Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. Placing these all-copper connections between computer chips and external circuitry will lead to increased computing speeds.
Graduate student Todd Spencer and Regents' professor Paul Kohl have developed an improved signal transmission line, made of an organic substrate, to link high-speed signals between computer chips.
Graduate student Tyler Osborn and Regents' professor Paul Kohl have developed a novel fabrication method to create all-copper connections between computer chips and external circuitry. Improving these connections will increase the amount and speed of information that can be sent throughout a computer.