Researcher Honored for Innovative Research and Technical Achievements Toward the Design and Realization of 3-D Integrated Computer Chips.

Newswise — Troy, N.Y. – Rensselaer Polytechnic Institute Professor James Jian-Qiang Lu was recently named a fellow of the Institute of Electrical and Electronics Engineers (IEEE).

In elevating him to a fellow, the IEEE cited Lu’s contributions to three-dimensional integrated circuit technology. An associate professor in the Department of Electrical, Computer, and Systems Engineering (ECSE) at Rensselaer, Lu is known as a pioneer and technical leader in 3-D computer chip integration, and has been working to design the processes and architecture that could one day be the platform for 3-D chips.

“We congratulate Dr. Lu on his election to the rank of fellow of IEEE. This is the highest honor earned from one’s peers and recognizes significant contributions to the field of electrical engineering,” said David Rosowsky, dean of the School of Engineering at Rensselaer. “Dr. Lu continues a long and rich tradition of research and innovation in electrical engineering at Rensselaer. We are proud to count him among our growing number of society fellows in the School of Engineering.”

Flat, conventional computer chips used today can only shrink so much smaller, as their flat surface must have enough room to accommodate scores of different components. But the semiconductor industry and academia are looking at ways to layer chip components into a vertical, 3-D stack, which could dramatically shrink the size of the overall chip and take advantage of high data bandwidth, performance efficiency, and functionality increase of the 3-D integration. Lu’s research spans a wide spectrum of micro- and nanoelectronics technology, from theory and design to materials, devices, processing, and system integration.

Lu is a member of the Rensselaer Center for Future Energy Systems, Center for Automation Technologies and Systems, and Smart Lighting Engineering Research Center.

For more information on Lu’s research at Rensselaer, visit www.rpi.edu/~luj along with:

• Slimmer, Stickier Nanorods Give Boost to 3-D Computer Chipshttp://news.rpi.edu/update.do?artcenterkey=2542

• Microchip Real Estatehttp://blogger.rpi.edu/approach/2009/03/17/microchip-real-estate-skinny-nanorods/

• Designing for New Dimensions http://www.rpi.edu/research/magazine/spring05/chips.html

• More Life for Moore’s Lawhttp://www.businessweek.com/magazine/content/05_25/b3938629.htm

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